Using lasers to mark products and components for electrical engineering applications entails a variety of challenges that must be overcome. One of these challenges is miniaturisation. Small chips, components and sensors must be marked with their serial and batch numbers. Data matrix codes are also a relatively common requirement, even where space is severely limited. Consistency between laser markings can only be achieved here because these high resolutions are themselves achieved by means of equally high-resolution laser movements and fine laser spots.
The materials used for these applications constitute a further challenge. Glass fibre reinforced plastics require laser systems that can offer the appropriate beam shapes and beam parameters. Highly reflective copper alloys and gold coatings also have particular requirements, which ACI Laser GmbH addresses using laser systems with second- and third-harmonic generation, for example.